HJT Technology

Double-sided μc-Si technology to ensure higher cell efficiency and module power, effectively reducing LCOE

Ultra-low Temperature Coefficient

-0.26%/℃ Pmax temperature coefficient to ensure lower power loss in high temperature environments

Polyisobutylene (PIB) Sealant

Stronger water resistance, better airtightness, and longer module lifespan

Higher Reliability

Industry-leading technology and performance warranty to ensure modules’ outstanding and stable performance

Better Power Generation Performance

Zero LID and PID for lower power loss

Up to 95% Bifaciality

Natural symmetrical bifacial structure to bring higher power generation on the backside

SMBB Technology

20BB has better light trapping and current collection to improve module power output

Low LOCE(Levelized Cost of Energy)

Reduce the cost of BOS efficiently and increase return on project investment